Cadence PCB Mini Option

Designers of high-end consumer electronics face the challenge of miniaturization and its resulting complexity. The number of nets on a printed circuit board (PCB) that have high-speed constraints is growing. As the industry migrates to multi-gigabit serial interfaces like PCI Express, the number of constraints on nets is also increasing. And as consumers demand ever-smaller gadgets packed with amazing features, complex die stacking is paramount to an IC packaging strategy.

Today’s PCB and package designers need a complete high-density interconnect (HDI) solution that includes high-speed rules, manages faster data throughput, and offers advanced routing capabilities to shrink footprints and meet aggressive market windows. 

PCB Mini Option Tutorial Videos